DESIGN OF READOUT INTEGRATED CIRCUIT FOR UNCOOLED INFRARED FOCAL PLANE ARRAYS BASED ON MICROCANTILEVER
نویسندگان
چکیده
منابع مشابه
Dependence of the Deformation of 128 128 InSb Focal-plane Arrays on the Silicon Readout Integrated Circuit Thickness
The square checkerboard buckling deformation appearing in indium antimonide infrared focal-plane arrays (InSb IRFPAs) subjected to the thermal shock tests, results in the fracturing of the InSb chip, which restricts its final yield. In light of the proposed three-dimensional modeling, we proposed the method of thinning a silicon readout integrated circuit (ROIC) to level the uneven top surface ...
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ژورنال
عنوان ژورنال: JOURNAL OF INFRARED AND MILLIMETER WAVES
سال: 2010
ISSN: 1001-9014
DOI: 10.3724/sp.j.1010.2010.00097